Within micro- and nanotech industry there is often a requirement to have small geometric/mechanical structures. To define and get these structures the manufacturing process “Lift Off” is used.
In the Lift Off process the first process is to spin a resist (mask) on to a wafer (thin silicon material). After that the mask is exposed and processed so that the wafer has the required masking. Then the wafer is ready to be coated in the Cryofox systems. After the coating the mask on the wafer is removed by a stripping machine.
Polyteknik has two Cryofox Explorer models that are extremely suitable for deposition in Lift Off processes.
In the Lift Off process there is a need for a very uniform line of incidence of the deposition material during the coating process. The Cryofox Explorer machine models for Lift Off processes have a long throw distance of the deposition material so that a uniform line of incidence is obtained.
The systems are used within production and research and development.
The process technology is based upon E-Beam and DC/RF sputtering.
All Cryofox systems can be integrated in clean room facilities.
Our solutions for Lift Off / MEMS are:
Cryofox Explorer 600 LT
Long throw distance E-Beam deposition
Ideal for Lift Off processes
Special developed for production and research
Cryofox Explorer 600 LT Flex
Long throw distance E-Beam deposition and DC/RF sputtering magnetrons
Ideal for Lift Off and general material research
